ChipInFlex is CEA-Leti’s latest development towards the integration of ultra-thin silicon bare dies within a flexible film. Nowadays, devices are both ultra-thin and flexible, which allows the introduction of an additional function around objects.

ChipInFlex is a generic wafer level process for manufacturing a flexible label, which integrates silicon components. CEA-Leti’s packaging team is the first to offer flip-chip silicon dies interconnection within a flexible film.

ChipInFlex is also the first packaging solution that can perform collective thinning on the wafer. The electrical interconnection is achieved with gold stud-bumps made on bare dies. The ChipInFlex process has been successfully validated on an electrical test vehicle. A first step towards full electronic system in a flexible label has been made.