About 5E project

The 5E project will underpin digitisation and support specifically the European electronics industry in seizing opportunities by federating – not merging – the 3 European electronics ecosystems, i.e. Nanoelectronics, Electronic Smart Systems, and Flexible and Wearable Electronics.

Federation will be achieved by developing a joint vision based on a thorough analysis of the state of play of the 3 ecosystems according to a standardised taxonomy, and focusing on the interfaces between the areas, as well as on opportunities for collaboration and cross-fertilisation.

A technology and application meta-roadmap will be elaborated and implemented at the levels of the 3 electronics ecosystems, the demand-side industries in application sectors, and the areas of digitisation, as well as on the European and regional policy levels.

Dedicated actions of 5E will further reinforce collaboration and outreach of the electronics industry across Europe – in all relevant value chains, sectors, areas and target groups – and at the international level, establishing and reinforcing international cooperation.

Targeted outreach and visibility actions aim at running EU-funded projects, large industry, SMEs, start-ups, but also at the demand-side, user communities and the wider public and include a toolbox, a digital library, digital showcase and a contest, thereby largely contributing to dissemination and exploitation, and hence to maximising impact.
5E will substantially contribute to all 8 impacts listed in the call, providing metrics (KPIs) for measuring and monitoring, and will additionally generate impact on the higher economic and societal levels.

30 Months
7 Partners
1 m € Budget
4 European Countries

France, Germany, Italy, Netherlands

Electronic areas

Nano-Electronics NE

Nanoelectronics area is providing the methodologies for the integration of new functionalities at high structural density on a single chip or device.
Functions like sensing, actuation, data processing, storage and communication as well as energy management are driven by news applications.

Nanoelectronics activities are devoted to:

  • More Moore (Ultimate CMOS/Memories)
  • Beyond CMOS (novel devices for ultra-low power -NW/TFET/NEMS…, alternative materials -2D layers…, new processes -bottom-up…)
  • Very advanced More than Moore (micro-nano-bio systems, RF devices, energy harvesting, etc.) fields

Flexible & Wearable Electronics FWE

Organic Large Area Electronics (OLAEs) are enabling applied technologies whose development has made significant progress over the last decade and have established themselves as a competitive growth industry. Despite proving that more and more products have matured onto the global market (e.g. OLED displays have become a truly mass-produced industrial product), this strong technological platform is now focussing on the uptake of technologies in the frame of Flexible & Wearable Electronics (FWE) enabling use cases. Therefore OLAEs can valorize their uniqueness (flexibility, conformability) and/or their inherent capability for solutions in the fast growing business of wearables and the Internet of Everything, more generally.

Electronic Smart Systems ESS

The term Smart System refers to the concepts of combining cognitive functions with sensing, actuation, data processing, storage and communication as well as energy management.

Electronic Smart Systems affect many aspects of our lives. They are bringing a new generation of diagnostic instruments to clinics. They are bringing innovative automatic safety systems to cars and public transport. They are becoming embedded into consumer goods, into the networks that power and inform society, and they are underpinning the efficient provision of public and private services. Increasingly they sense their surroundings, operate autonomously and collaborate with other Electronic Components and Systems.

Project objectives

1.

Support industrial perspectives
of the European electronics ecosystems

2.

Position electronics as
fundamental for digitisation

3.

Foster collaboration and
cross-fertilisation in electronics

Work Packages overview

Work Package 1 - Project Management

  • Provide overall project governance
  • Ensure the efficient execution of the Work Plan
  • Ensure efficient communication and interaction within the consortium and the larger community
  • Report to and interface with the EC

 

Lead VDI/VDE

Work Package 2 - State of Play & Joint Vision

  • Describe a unified landscape of the three electronics areas and their interfaces
  • Identify white spots at these interfaces
  • Develop a joint vision for competitive electronics industries in Europe
Lead CEA

Work Package 3 - Roadmapping

  • Establish a link between status quo and joint vision
  • Identify sweet spots for reinforced collaboration and cross-fertilisation
  • Establish a technology and application meta-roadmap with concrete steps to realise joint vision

 

Lead HOLST-IMEC

Work Package 4 - Implementation

  • Promote the technology and application meta-roadmap
  • Foster take-up of recommendations
  • Support dissemination of EC strategy on Electronics

 

Lead VDI/VDE

Work Package 5 - Fostering Cooperation

  • Identify and liaise with stakeholders
  • Address and involve especially DIHs
  • Share experience and best practice
  • Plan and implement common actions
  • Support international cooperation

 

Lead HSG

Work Package 6 - Outreach

  • Support the other work packages in reaching out to all target groups
  • Increase weight, visibility and impact of federated electronics ecosystems
  • Provide occasions to SMEs, projects and DIHs to better spread results

 

 Lead MESAP