FLEPS 2019

The 1st edition of the IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS 2019) will be held in Glasgow – Scotland from 7th to 10th July.

In recent years, material printing on flexible and disposable substrates has received substantial interest for realizing low cost, large-area electronics and sensing systems. As a result, new methods such as printing and additive manufacturing, etc. have also received significant attention to develop a wide range of easily deployable systems such as displays, sensors and RFID tags. The technologies developed for silicon based planar electronics and solid-state sensors is also being re-purposed to meet the demands in the emerging field of flexible and printed sensors. This trend will continue as all market indicators point towards significant growth in this area. Given the exponential growth seen in the flexible, printed and disposable sensor technology, the development of novel printable and solution processable nanomaterials, and the development of novel printing techniques that have brought about a new wave of novel printed sensor technologies and applications, the IEEE FLEPS offers an excellent forum to discuss latest developments in the field as well as understand the future roadmap.

IEEE FLEPS 2019 is intended to provide a forum for research scientists, engineers, and practitioners throughout the world to present their latest research findings, ideas, and applications in the area of Flexible and Printable Sensors and Systems.

The event will see the participation of the 5E project partner Corne Rentrop (Hybrid Printed Electronics Group at the Holst Center, TNO) as speaker. He will explain the fundamentals and applications of hybrid printed Electronics and how to integrate into flexible, stretchable and three-dimensional products. The keynote will address the available manufacturing techniques for hybrid printed electronics comprising of state-of-the-art printing steps, electrical component assembly, post-processing steps, product integration steps and (electrical) characterisation methods.

Further information and the programme are available at http://www.fleps2019.org/

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